http://lw.pennnet.com/display_article/341429/13/ARTCL/none/NNEWS/1/Photonic-Integration-Forum-to-tackle-integration-metrics/?dcmp=LWDENL
OCTOBER 2, 2008 By Stephen Hardy – The Optoelectronic Industry Development Association (OIDA; search for OIDA) will join with Infinera Corp. (search for Infinera) next week to host a discussion of the current state of photonic integration and chart a roadmap toward future development in this area. The Photonic Integration Forum, sponsored by the Defense Advanced Research Projects Agency, will be held October 7-8 at the Monterey Plaza Hotel & Spa, Monterey, CA. A central focus of the forum will be the development of metrics to measure the progress of integration development, according to a source at Infinera.
OIDA (The Optoelectronic Industry Development Association) 가 Infinera 와 다음주에 만난다. Photonic integration 과 앞으로의 개발 로드맵에 대해 토의할 예정.
the Defense Advanced Research Projects Agency 가 돕고 있는 The Photonic Integration Forum은 10월 7-8일에 열린다.
The two-day event will combine an array of speakers from industry and academia with breakout sessions devoted to telecom, datacom/computer interconnect, and emerging applications. A full agenda and registration information can be found at http://www.oida.org/events/integration08.
이틀간의 일정에서는 산업계와 학계의 연사들이 발표할 예정. 기타 telecom, datacom/computer interconnect, and emerging application 세션. http://www.oida.org/events/integration08 여기가면 정보 있다.
As discussed in an article that will appear in Lightwave's October issue, photonic integration holds significant promise as a means to meet future component requirements for higher speeds, lower power consumption, and smaller size. While integration is well understood in the electronic domain -- it's the basis of Moore's Law -- photonic and optoelectronic integration is in its early stages, with many companies focusing on either hybrid or monolithic paths using a variety of material structures.
photonic integration 의 장점 - 장래성 있는 기술
전자 분야에서는 integration 이 잘 알려져 있다 - 무어의 법칙에 기초하여.
그런데 photonics 과 optoelectronic integration 은 초기 단계이다. 많은 회사들이 hybrid 혹은 monolithic paths 연구한다, 많은 재료들을 이용하여
While hybrid integration will be addressed during the forum, "definitely a large part of the discussion and focus will be looking at monolithic integration technologies," according to Serge Melle, vice president of technical marketing at photonic integration pioneer Infinera. "But not just limited to indium phosphide; a lot of it will be looking at silicon. And across a wide range of applications – not just telecom, but also data center applications and computing applications as well."
Hybrid 보다는 monolithic integration 이 더 주목받는다. - Serge Melle - Infinera 부사장
InP 에 제한된 것이 아니다. 많은 부분은 실리콘이 될 것이다. 많은 응용 분야에서 - 단지 텔레콤 뿐만 아니라, 데이터 센터 어플이나 컴퓨팅 어플에서도
The discussions will also cover the integration of both active and passive functions.
In addition to the identification of areas of continued R&D that may be necessary to bring photonic integration to market and produce increasingly capable devices, how to measure and discuss levels of integration will also be debated, particularly in the breakout sessions. Melle points out that in the electronics world, gates per square centimeter is a common metric for integration. No counterpart currently exists in the photonic domain.
능동 수동소자 집적도 토의되었다. photonics integration 에서 집적도의 수준을 어떻게 측정할 거냐 하는게 토의됨. Melle 에 따르면 전자분야는 제곱 cm당 gates 수를 가지고 말하는데, photonic 분야에는 그런 기준이 없다.
"Oftentimes photonic integrated circuits are more being used for communications or transmission of information. So some examples of metrics that could be tracked would be transmission capacity per chip -- how many gigabits per second of opto-electric I/O capacity you can get per chip. Another one could be the number of components integrated per chip," Melle offers. "Other ones that could be relevant to look at would be reliability, so FIT rate; manufacturability, so, for example, percentage yield; or, for example, power per gigabits per second.
PLC 칩은 통신이나 정보전송에 많이 이용되니까, 칩당 전송량 - 즉 한개의 칩에서 초당 몇기가바이트 전송하느냐로 할 수도 있다.
또 다른 예는 칩당 집적된 컴퍼넌트의 수가 될 수 있다. - Melle 가 계속 말하고 있음 - 또 다른건, 신뢰성이나 제작성 (제작용이성??) - 수율 퍼센티지, 혹은 power per 기가비트 per 초
"I think probably the two most relevant would be transmission capacity per chip and components integrated per chip," he adds.
The forum will result in a report from OIDA that Melle describes as "a photonic integration trend map" that will reflect the conclusions of the multi-industry breakout sessions as well as the forum presentations.
Melle 생각에는 가장 적절한 것은 칩당 전송량 이나 칩당 집적된 컴퍼넌트 수 정도
포럼은 "a photonic integration trend map" 이라고 하는 OIDA 리포트를 결과물로 만들거다. 이건 포럼 프레젠테이션 뿐만 아니라 다양한 산업 전시세션의 결과물리 반영될거다.
"There's been some discussion of photonic integration at fiber-optic conferences like OFC," Melle concludes. "But I don't think anywhere to date in the industry or anywhere in the world has there been such a broad discussion of photonic integration -- and with that, the range of speakers [to be included]."
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OIDA (http://www.oida.org/events/integration08) 내용
Photonic integration for telecom applications: PICs in fiber optical transport networks
- Active PICs for use in transmit/receive applications to enable low-cost optical-electrical-optical (OEO) conversion in WDM and FTTx networks
- Optical amplification using PICs and operation over the full fiber spectrum
- Passive PICs used in all-optical applications including ROADMs, WSS, optical switches and hybrid integrated circuits
- Commercial status and deployments: overview of PIC commercialization and deployment, case studies and examples
Photonic integration for data center and computer interconnect applications
- Recent advances in device performance, key building blocks needed for “siliconizing”
- Application drivers and requirements for processor interconnection, photonic backplanes, server/computer interconnection
- State of technology availability and commercial use
Research directions in photonic integration
- Panel on industry roadmap for integrated photonic technology development and commercialization
- Can all network functions be integrated on chips?
- What is the biggest challenge to multi-terabit?
- Novel devices and integration methods: devices for uncooled applications, 3D photonics
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